Electroless nickel-boron plating process for metal ink circuits on sintered substrates.
Electroless nickel-boron plating process on metal ink circuits on sintered substrates with excellent bath stability.
Optical communication module components and package components are advancing in fine wiring, and the required pattern quality for electroless nickel plating is becoming increasingly demanding. Our company has newly developed an electroless nickel-boron plating process on metal ink paste for sintered substrates that excels in pattern quality compared to conventional methods.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
